High Thermal Conductivity Low Bleed Stable
Uses: Thermal Coupling of Electrical Device to Heatsinks
Thermal Conductivity: >1.93 W/m-k
Thermal Impedance: <0.120°C-in²/W
For CPU Cooler Use
N. W. 1.0 Gram
High Thermal Conductivity Low Bleed Stable
Uses: Thermal Coupling of Electrical Device to Heatsinks
Thermal Conductivity: >1.93 W/m-k
Thermal Impedance: <0.120°C-in²/W
For CPU Cooler Use
N. W. 1.0 Gram
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